AB3505LX-QB0 ADDA 5V 35x35x10mm DC Centrifugal Blower

Description

The ADDA AB3505LX-QB0 is a high-performance 5 VDC DC Centrifugal Blower with dimensions of 35 x 35 x 10 mm, specifically engineered for ultra-compact thermal management in portable electronic devices and micro-projectors. Driven by a brushless DC motor with a power consumption of 0.5 W and a nominal current of 0.10 A, this precision turbine blower operates at a rated speed of 5500 RPM, delivering an actual air flow of 0.91 CFM (1.55 m³/h) while maintaining an ultra-low noise level of 20 dB(A). Constructed with a ruggedized metal housing for enhanced structural integrity and a high-precision Hypro bearing system featuring an 11-blade high-pressure impeller, this 13 g unit provides a dependable and energy-efficient side-exhaust air-moving solution with impedance protection for portable medical devices, VR/AR headsets, and localized cooling for high-performance chipsets in compact embedded systems.

AB3505LX-QB0 Fan Parameters
Model Number: AB3505LX-QB0
Manufacturer: ADDA
Series: AB Series
Type: DC Centrifugal Blower
Impeller Size: 30 mm
Dimensions: 35 x 35 x 10 mm
Weight: 13 g
Bearing Type: Hypro Bearing
Nominal Voltage: 5 VDC
Voltage Range: 4.5 – 5.5 VDC
Power Consumption: 0.5 W
Nominal Current: 0.10 A
Speed: 5500 RPM
Max. Air Flow: 62.23 CFM (105.7 m³/h / 1.76 m³/min)
Max. Static Pressure: 9.81 mmH₂O (96.24 Pa / 0.39 inH₂O)
Actual Air Flow: 0.91 CFM (1.55 m³/h)
Actual Static Pressure: 0.14 inAq (34.8 Pa)
Noise Level: 20 dB(A)
Motor Protection: Impedance protected
Insulation Class: Class A
Electrical Hookup: 2 Lead wires
Number of Blades: 11
Direction of Rotation: Counter-clockwise, viewed toward rotor
Housing Material: Metal (Aluminum / Zinc Alloy)
Impeller Material: Plastic (UL94V-0)
Installation Position: Any
Operating Temperature: -10 – +70 °C
Storage Temperature: -40 – +70 °C
Standard Compliance: UL; CUL; TUV; CE

Application
The ADDA AB3505LX-QB0 blower is primarily utilized in portable medical devices, micro-projectors, VR/AR headsets, and localized cooling for high-performance chipsets in compact embedded systems.